A 100-GHz distributed amplifier in chip-size package

被引：8

作者：

Masuda, S ^{[1
]}

Kobayashi, K ^{[1
]}

Kira, H ^{[1
]}

Kitajima, M ^{[1
]}

Takesue, M ^{[1
]}

Karniya, Y ^{[1
]}

Joshin, K ^{[1
]}

机构：

[1] Fujitsu Labs Ltd, Atsugi, Kanagawa 2430197, Japan

来源：

2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2003年

关键词：

D O I：

10.1109/MWSYM.2003.1212544

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz; by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines that has a bandwidth of beyond 110 GHz. The CSP amplifier achieved a gain of 7.8 dB and a 3dB bandwidth of 97 GHz, and operated up to 100 GHz as an amplifier. To our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP.

引用

页码：1029 / 1032

页数：4

共 11 条

[1] Aoki S, 1997, IEEE MTT-S, P731, DOI 10.1109/MWSYM.1997.602894
[2] RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill
Feng, ZP
Zhang, WG
Su, BZ
Gupta, KC
Lee, YC
[J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (12) : 2269 - 2275
[3] A flip-chip MMIC design with coplanar waveguide transmission line in the W-band
Hirose, T
Makiyama, K
Ono, K
Shimura, TM
Aoki, S
Ohashi, Y
Yokokawa, S
Watanabe, Y
[J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (12) : 2276 - 2282
[4] KITAJIMA M, 2002, Patent No. 6361626
[5] Maruhashi K., 2000, 2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056), P324, DOI 10.1109/ISSCC.2000.839800
[6] Masuda S, 2002, TG IEEE GAL ARS, P99, DOI 10.1109/GAAS.2002.1049038
[7] OHASHI Y, 1998, P 1998 EUR MICR C, V2, P433
[8] Schmückle FJ, 2002, IEEE MTT S INT MICR, P1393, DOI 10.1109/MWSYM.2002.1012115
[9] 76GHz flip-chip MMICS for automotive radars
Shimura, T
Kawasaki, Y
Ohashi, Y
Shirakawa, K
Hirose, T
Aoki, S
Someta, H
Makiyama, K
Yokokawa, S
[J]. 1998 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, 1998, : 25 - 28
[10] STURDIVANT R, 1995, IEEE MTT-S, P1591, DOI 10.1109/MWSYM.1995.406280

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