Semiconductor inspection system for yield enhancement

被引：0

作者：

Usami, Y ^{[1
]}

Kawata, I ^{[1
]}

机构：

[1] Hitachi Ltd, Syst Solut Grp, Elect Syst Operat, Chiyoda Ku, Tokyo 1008220, Japan

来源：

BEAM INJECTION ASSESSMENT OF MICROSTRUCTURES IN SEMICONDUCTORS, 2000 | 2000年 / 78-79卷

关键词：

0.1 mu m process; defect review; semiconductor inspection; yield;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

As the American SIA (Semiconductor Industry Association) technology roadmap shows, semiconductor devices are moving toward higher circuit integration and density. There is also a need for device inspection equipment and systems that meet high performance requirements. A total inspection system that enables efficient operation at an appropriate investment is proposed. (Fig. 1) This inspection system includes both high sensitivity and high throughput equipment as well as analytical systems for efficient analysis of yield parameters.

引用

页码：149 / 156

页数：8