Study of diffusion and atomic mobilities for fcc Ag-Cd and Ag-Sn solder alloys

Diffusion in Ag-based solders is a practical topic that has attracted world-wide attention. With the available experimental data in the literature, the atomic mobilities of Ag, Cd and Sn in fcc Ag-Cd and Ag-Sn alloys are critically explored in this work. The proposed atomic mobility parameters can reproduce a great majority of experimental data, including impurity diffusion coefficients, tracer diffusion coefficients, intrinsic diffusion coefficients and interdiffusion coefficients. The evolutions of composition profiles and Kirkendall marker shifts in Ag-Cd binary diffusion couples are also computationally studied. The atomic mobilities obtained in this work are essential to guide the design of candidate Ag-based alloys. Published by Elsevier Ltd