Study of diffusion and atomic mobilities for fcc Ag-Cd and Ag-Sn solder alloys

被引：5

作者：

Liu, Yajun ^{[1
]}

Wang, Jiang ^{[2
]}

Du, Yong ^{[3
]}

Sheng, Guang ^{[4
]}

Zhang, Lijun ^{[3
]}

Liang, Dong ^{[5
]}

机构：

[1] Montana State Univ, Western Transportat Inst, Bozeman, MT 59715 USA

[2] EMPA, Swiss Fed Labs Mat Testing & Res, Lab Joining & Interface Technol, CH-8600 Dubendorf, Switzerland

[3] Cent S Univ, State Key Lab Powder Met, Changsha 410083, Hunan, Peoples R China

[4] Penn State Univ, Dept Mat Sci & Engn, University Pk, PA 16802 USA

[5] DNV Columbus, Dublin, OH 43017 USA

来源：

CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY | 2011年 / 35卷 / 02期

关键词：

Fcc Ag-Cd and Ag-Sn alloys; Atomic mobility; Diffusion; CALPHAD; DICTRA; SILVER-CADMIUM ALLOYS; THERMODYNAMIC PROPERTIES; POLYCRYSTALLINE SILVER; SOLVENT DIFFUSION; SOLID SOLUTIONS; ALPHA; FE; NI; SYSTEM; TIN;

D O I：

10.1016/j.calphad.2011.01.001

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Diffusion in Ag-based solders is a practical topic that has attracted world-wide attention. With the available experimental data in the literature, the atomic mobilities of Ag, Cd and Sn in fcc Ag-Cd and Ag-Sn alloys are critically explored in this work. The proposed atomic mobility parameters can reproduce a great majority of experimental data, including impurity diffusion coefficients, tracer diffusion coefficients, intrinsic diffusion coefficients and interdiffusion coefficients. The evolutions of composition profiles and Kirkendall marker shifts in Ag-Cd binary diffusion couples are also computationally studied. The atomic mobilities obtained in this work are essential to guide the design of candidate Ag-based alloys. Published by Elsevier Ltd

引用

页码：224 / 230

页数：7

共 32 条

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