Development of Sn-Bi systems lead-free solder paste

被引：0
作者：
Li, Kangning [1 ]
Lei, Yongping
Lin, Jian [1 ]
Liu, Baoquan [2 ]
Bai, Hailong [2 ]
Qin, Junhu [2 ]
机构：
[1] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing, Peoples R China
[2] Yunnan Tin Mat Co Ltd, Yunnan 650217, Peoples R China
来源：
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年
基金：
北京市自然科学基金; 中国国家自然科学基金;
关键词：
lead-free solder paste; flux; low temperature; wettability;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The contents of solvent, rosin and activator were adjusted to obtain the most appropriate proportion of the flux for Sn-Bi based lead free solder material by a series of orthogonal experiments. Compared with some commercial Sn-Bi based solder pastes, some tests about the solder paste, such as solder ball test, wettability test and slump test had been carried on. It was found that the self-made Sn-Bi based solder paste had an excellent performance. The welding spots had good appearance; the residues solidified well. The effect of the solder powder ratio on rheological and printing behavior had been studied. When the mass ratio was 12:88wt%, the best rheological and printing properties of solder paste could be obtained.
引用
收藏
页码：160 / +
页数：2
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