On the design of Phase Change Materials based thermal management systems for electronics cooling

被引:33
作者
Righetti, Giulia [1 ]
Zilio, Claudio [1 ]
Doretti, Luca [2 ]
Longo, Giovanni A. [1 ]
Mancin, Simone [1 ]
机构
[1] Univ Padua, Dept Management & Engn, Str Lla S Nicola 3, I-36100 Vicenza, Italy
[2] Univ Padua, Dept Civil Environm & Architectural Engn, I-35100 Padua, Italy
关键词
Phase Change Material; PCM; Electronics cooling; 3D Periodic structures; Latent heat storage; HEAT-TRANSFER ENHANCEMENT; ENERGY STORAGE; PCM; PERFORMANCE; SINK; PIPE;
D O I
10.1016/j.applthermaleng.2021.117276
中图分类号
O414.1 [热力学];
学科分类号
摘要
This work aims at explaining the effect of the operating conditions on the performance of passive electronic thermal management systems based on Phase Change Materials. The low thermal conductivity of the Phase Change Materials is usually felt as one of their major limitations that hinders the effective heat transfer capability of the whole passive system. However, the present study experimentally demonstrates that the real improvement due to the use of enhanced heat transfer surfaces depends upon the operating conditions. The experimental tests were run on a latent thermal management system based on a paraffin wax with a 70 degrees C phase change temperature embedded in two different samples: an aluminum 3D pyramidal periodic structure having a porosity of 0.95 and a cell dimension of 10 mm realized via additive manufacturing, and an empty sample used as reference. The system was experimentally tested under several working conditions to simulate the real operation of an electronic device, including complete melting/solidification cycle and intermittent operations at different ambient temperatures, in natural and forced convection. The main outcome of the present study is that, when considering the junction temperature, the use of the enhanced surface does not always lead to an improvement of the heat transfer performance especially during fast intermittent operations and thus the maximum effective thermal conductivity cannot be always considered the main design objective. A novel integrated design approach should include the properties of the Phase Change Material, the system requirements and the real operating conditions.
引用
收藏
页数:10
相关论文
共 50 条
  • [1] Review of thermal management of electronics and phase change materials
    Ghadim, H. Benisi
    Godin, A.
    Veillere, A.
    Duquesne, M.
    Haillot, D.
    RENEWABLE & SUSTAINABLE ENERGY REVIEWS, 2025, 208
  • [2] Recent advances in phase change materials-based battery thermal management systems for electric vehicles
    Cai, Shaowei
    Zhang, Xuelai
    Ji, Jun
    JOURNAL OF ENERGY STORAGE, 2023, 72
  • [3] Enhanced thermal management by introducing nanoparticle composite phase change materials for cooling multiple heat sources systems
    Wang, Jin
    Yu, Kai
    Duan, Runze
    Xie, Gongnan
    Sunden, Bengt
    ENERGY, 2021, 227
  • [4] Application of phase change materials in thermal management of electronics
    Kandasamy, Ravi
    Wang, Xiang-Qi
    Mujunidar, Arun S.
    APPLIED THERMAL ENGINEERING, 2007, 27 (17-18) : 2822 - 2832
  • [5] Graphene enhanced paraffin nanocomposite based hybrid cooling system for thermal management of electronics
    Joseph, Mathew
    Sajith, V.
    APPLIED THERMAL ENGINEERING, 2019, 163
  • [6] Cooling of Electronics with Phase Change Materials
    Saha, S. K.
    Dutta, P.
    INTERNATIONAL CONFERENCE ON MODELING, OPTIMIZATION, AND COMPUTING, 2010, 1298 : 31 - +
  • [7] Phase change materials for lithium-ion battery thermal management systems: A review
    Li, Zaichao
    Zhang, Yuang
    Zhang, Shufen
    Tang, Bingtao
    JOURNAL OF ENERGY STORAGE, 2024, 80
  • [8] AN INVESTIGATION INTO THE SOLIDIFICATION OF NANO-ENHANCED PHASE CHANGE MATERIAL FOR TRANSIENT THERMAL MANAGEMENT OF ELECTRONICS
    Sanusi, Omar
    Fleischer, Amy
    Weinstein, Randy
    2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
  • [9] Liquid metal phase change materials for thermal management of electronics
    Yao, Yuchen
    Li, Wei
    Liu, Jing
    Deng, Zhongshan
    ADVANCES IN PHYSICS-X, 2024, 9 (01):
  • [10] Combined effects of heat input and clamping pressure on the thermal performance of phase change thermal interface materials for electronics cooling applications
    Maalej, S.
    Saad, I
    Nasri, M. A.
    Zaghdoudi, M. C.
    THERMAL SCIENCE AND ENGINEERING PROGRESS, 2022, 28