Multiple-chip module design optimizations using a novel layout parameterization technique

被引：1

作者：

Huang, CWP ^{[1
]}

Dow, GS ^{[1
]}

Bao, JW ^{[1
]}

Kuran, S ^{[1
]}

Sercu, J ^{[1
]}

机构：

[1] ANADIGICS Inc, Warren, NJ 07059 USA

来源：

2003 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS | 2003年

关键词：

D O I：

10.1109/RFIC.2003.1214015

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel layout parameterization technique for multi-chip module design optimizations is presented. This technique is based on a quasi-static method of moments and multi-dimensional interpolation, which can reduce a 12-minute electromagnetic layout simulation to 5.3 seconds. Excellent CDMA power amplifier (PA) module performance is achieved based on this technique.

引用

页码：587 / 590

页数：4

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