Plastic deformation behavior analysis of an electrodeposited copper thin film under fatigue loading

被引:12
作者
Hwangbo, Yun [1 ,2 ]
Song, Ji-Ho [3 ]
机构
[1] Korea Inst Machinery & Mat, Dept Nano Convergence, Taejon 305343, South Korea
[2] Korea Inst Machinery & Mat, Mfg Syst Res Div, Taejon 305343, South Korea
[3] Korea Adv Inst Sci & Technol, Dept Mech Engn, Taejon 305701, South Korea
关键词
Electrodeposited copper thin film; Fatigue test; Weibull distribution; Monotonic plastic strain (ratcheting strain); Master curve of fatigue life; CYCLE FATIGUE; TENSILE; STRAIN;
D O I
10.1016/j.ijfatigue.2011.02.005
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
This paper presents a method for estimating the fatigue life of an electrodeposited copper film. From fatigue tests at various mean stresses, the monotonic plastic strain (ratcheting strain) was found to be directly related to fatigue damage, and could be used as a measure of the damage. Accordingly, in this study, monotonic plastic strain (ratcheting strain) behavior, and hence also fatigue damage, is analyzed via the Weibull distribution function, and the fatigue life of a copper thin film is estimated. In addition, a master curve for the fatigue life of the copper thin film is derived. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1175 / 1181
页数:7
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