Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

被引：146
作者：
Peng, Weiqun
Monlevade, Eduardo
Marques, Marco E.
机构：
[1] Nokia Res Ctr, Irving, TX 75039 USA
[2] Nokia Inst Technol, BR-69093415 Manaus, Amazonas, Brazil
来源：
MICROELECTRONICS RELIABILITY | 2007年 / 47卷 / 12期
关键词：
D O I：
10.1016/j.microrel.2006.12.006
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Interfacial structure plays a great role in solder joint reliability. In solder joints on Cu, not only is Kirkendall voiding at the solder/Cu interface a concern, but also the growth of interfacial Cu-Sn intermetallic compounds (IMCs). In this work, evolution of microstructure in the interfacial region was studied after thermal aging at 100-150 degrees C for up to 1000 h. Special effort was made during sample preparation to reveal details of the interfacial structure. Thickness of the interfacial phases was digitally measured and the activation energy was deduced for the growth Of Cu3Sn. Kirkendall voids formed at the Cu/Cu3Sn interface as well as within the Cu3Sn layer. The thickness Of Cu3Sn significantly increased with aging time, but that Of Cu6Sn5 changed a little. The interfacial Cu3Sn layer was found growing at the expense Of Cu6Sn5. Evolution of the interfacial structure during thermal aging is discussed. (C) 2007 Published by Elsevier Ltd.
引用
收藏
页码：2161 / 2168
页数：8
相关论文
共 17 条
[1]  
Biunno N, 1999, SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, P561
[2]   Manufacturing concerns of the electronic industry regarding intermetallic compound formation during the soldering stage [J].
Blair, HD ;
Pan, TY ;
Nicholson, JM ;
Cooper, RP ;
Oh, SW ;
Farah, AR .
NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, :282-292
[3]   Effect of thermal aging on board level drop reliability for Pb-free BGA packages [J].
Chiu, TC ;
Zeng, KJ ;
Stierman, R ;
Edwards, D ;
Ano, K .
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, :1256-1262
[4]   Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates [J].
Flanders, DR ;
Jacobs, EG ;
Pinizzotto, RF .
JOURNAL OF ELECTRONIC MATERIALS, 1997, 26 (07) :883-887
[5]  
GARNER L, 2005, INTEL TECHNOL J, V9, P297
[6]   GROWTH OF ALLOY LAYER BETWEEN SOLID COPPER AND LIQUID TIN [J].
KAWAKATSU, I ;
OSAWA, T ;
YAMAGUCHI, H .
TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1972, 13 (06) :436-443
[7]   Intermetallic compound layer formation between Sn-3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni-P/Cu) substrate [J].
Lee, CB ;
Yoon, JW ;
Suh, SJ ;
Jung, SB ;
Yang, CW ;
Shur, CC ;
Shin, YE .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2003, 14 (08) :487-493
[8]   Influence of intermetallic compounds on the adhesive strength of solder joints [J].
Lee, HT ;
Chen, MH .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2002, 333 (1-2) :24-34
[9]   Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu [J].
Lee, TY ;
Choi, WJ ;
Tu, KN ;
Jang, JW ;
Kuo, SM ;
Lin, JK ;
Frear, DR ;
Zeng, K ;
Kivilahti, JK .
JOURNAL OF MATERIALS RESEARCH, 2002, 17 (02) :291-301
[10]  
LUBYOVA Z, 1975, Z METALLKD, V66, P179
12