LED Flip Chip Packaging Trends with Tear down Study

被引：0
|
作者：
Onishi, T. [1 ]
机构：
[1] Grand Joint Technol Ltd, Hong Kong, Hong Kong, Peoples R China
来源：
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2014年
关键词：
LED lighting; LED flip chip device; X-rays analysis;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
LED Solid state lighting is becoming increasingly important in the future & high performance is required more. Checking LED device actual inside, to confirm packaging structure and key LED packaging technology current status of Europe, US and Asian LED flip chip packaging. Also describe the current status of research and development situation on LED flip-chip and wafer-level LED packaging. This paper show LED flip chip packaging technology trends. - Study of LED high power flip chip type packaging technology with x-rays analysis - Key LED packaging technology trends
引用
收藏
页码：198 / 199
页数：2
相关论文
共 50 条
  • [31] Technology comparisons and the economics of flip chip packaging
    Prasad, S.
    Sathyanarayan, S.
    Solid State Technology, 2001, 44 (3 SUPPL.)
  • [32] The underfIll processing technologies for flip chip packaging
    Chai, K
    Wu, L
    POLYTRONIC 2001, PROCEEDINGS, 2001, : 119 - 123
  • [33] Router flip chip packaging solution and reliability
    Tosaya, E
    Ouimet, S
    Martel, R
    Lord, R
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1153 - 1160
  • [34] Technology comparisons and the economics of flip chip packaging
    Prasad, S
    Sathyanarayan, S
    SOLID STATE TECHNOLOGY, 2001, : S18 - +
  • [35] Flip-chip packaging reliability advances
    Alcoe, David
    Blackwell, Kim
    Laine, Eric
    Advanced Packaging, 2000, 9 (06):
  • [36] Development packaging solutions: Flip chip and beyond
    Grigorov, Ilya
    Advanced Packaging, 2003, 12 (06): : 21 - 23
  • [37] Solder bumping methods for flip chip packaging
    Rinne, GA
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 240 - 247
  • [38] Flip-chip packaging for smart MEMS
    Mayer, F
    Ofner, G
    Koll, A
    Paul, O
    Baltes, H
    SMART STRUCTURES AND MATERIALS 1998: SMART ELECTRONICS AND MEMS, 1998, 3328 : 183 - 193
  • [39] Stress Monitoring in Flip Chip Packaging Process
    Jiang, Chengjie
    Xiao, Fei
    Dou, Chuanguo
    Yang, Heng
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1056 - 1060
  • [40] Thermal Performance of LED Filament in Flip-Chip Packaging Manufactured for Different Correlated Color Temperature
    Jiang, He
    Sa, Jiming
    Fan, Cong
    Zhou, Yiwen
    Gu, Hanwen
    Yang, Xuezhou
    Su, Xiaofeng
    Zhang, Zhushanying
    APPLIED SCIENCES-BASEL, 2021, 11 (19):
12345