LED Flip Chip Packaging Trends with Tear down Study

被引：0
|
作者：
Onishi, T. [1 ]
机构：
[1] Grand Joint Technol Ltd, Hong Kong, Hong Kong, Peoples R China
来源：
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2014年
关键词：
LED lighting; LED flip chip device; X-rays analysis;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
LED Solid state lighting is becoming increasingly important in the future & high performance is required more. Checking LED device actual inside, to confirm packaging structure and key LED packaging technology current status of Europe, US and Asian LED flip chip packaging. Also describe the current status of research and development situation on LED flip-chip and wafer-level LED packaging. This paper show LED flip chip packaging technology trends. - Study of LED high power flip chip type packaging technology with x-rays analysis - Key LED packaging technology trends
引用
收藏
页码：198 / 199
页数：2
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