LED Flip Chip Packaging Trends with Tear down Study

被引：0
|
作者：
Onishi, T. [1 ]
机构：
[1] Grand Joint Technol Ltd, Hong Kong, Hong Kong, Peoples R China
来源：
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2014年
关键词：
LED lighting; LED flip chip device; X-rays analysis;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
LED Solid state lighting is becoming increasingly important in the future & high performance is required more. Checking LED device actual inside, to confirm packaging structure and key LED packaging technology current status of Europe, US and Asian LED flip chip packaging. Also describe the current status of research and development situation on LED flip-chip and wafer-level LED packaging. This paper show LED flip chip packaging technology trends. - Study of LED high power flip chip type packaging technology with x-rays analysis - Key LED packaging technology trends
引用
收藏
页码：198 / 199
页数：2
相关论文
共 50 条
  • [1] Packaging issues on combination of LED and flip chip
    Zhao, Kun
    Ma, Shiwei
    Su, Shihu
    Zhang, Jianhua
    Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, : 294 - 298
  • [2] Flip chip packaging
    Werner, RG
    Frear, DR
    DeRosa, J
    Sorongon, E
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 1999, : 246 - 251
  • [3] The study on LED droop of flip-chip GaN LED
    Zhang, Yu
    Zhu, Xin-Feng
    Yao, Cheng
    Qin, Wei Qi
    Xiao, Jing
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1047 - 1050
  • [4] Tomorrows Packaging - Chip Scale Packaging vs Flip Chip
    Boustedt, K.
    Vardaman, E.J.
    Microelectronics International, 1997, 14 (03): : 31 - 32
  • [5] Substrates for flip Chip Packaging
    电子工业专用设备, 2006, (08) : 93 - 98
  • [6] Study on surface tension and adhesion for flip chip packaging
    Luo, SJ
    Harris, T
    Wong, CP
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 299 - 304
  • [7] Lid adhesive failure study for flip chip packaging
    Ong, M. C.
    Zhao, X. L.
    Joman, P. P.
    Chin, J. M.
    Master, Raj N.
    IPFA 2008: PROCEEDINGS OF THE 15TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2008, : 132 - +
  • [8] VOID-FREE UNDERFILL ENCAPSULATION FOR FLIP CHIP HIGH VOLTAGE LED PACKAGING
    Shang, Andrew W.
    Qiu, Xing
    Lo, Jeffery C. C.
    Lee, S. W. Ricky
    Le, Fred F.
    2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2016,
  • [9] Wafer level flip chip packaging
    Tong, QK
    Ma, B
    Savoca, A
    MICRO MATERIALS, PROCEEDINGS, 2000, : 244 - 244
  • [10] Flip chip packaging for MEMS microphones
    Feiertag, Gregor
    Winter, Matthias
    Leidl, Anton
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2010, 16 (05): : 817 - 823
12345