Hygrothermal degradation of two rubber-toughened epoxy adhesives: Application of open-faced fracture tests

The absorption/desorption properties of two commercial, toughened epoxy adhesive systems were evaluated gravimetrically, and by X-ray photoelectron spectroscopy (XPS) and dynamic mechanical thermal analysis (DMTA). Fracture tests on degraded open-faced DCB specimens showed that these two adhesive systems have very different degradation behaviors. The steady-state critical strain energy release rate, G(cs), of an adhesive system 1 decreased rapidly with an exposure time in various hot-wet environments, reaching a relatively low value that was stable for over one year, while that of adhesive system 2 remained unchanged for more than one and a half years. A degradation mechanism which accounts for the different characteristics of the two adhesive systems was proposed. A model of fracture toughness degradation, analogous to Fick's law, was then used to characterize the fracture toughness loss in an adhesive system 1, and the effects of temperature, RH and water concentration were evaluated. The results illustrate the wide variation in water absorption behaviors that can exist among toughened epoxy adhesives, and show how these differences relate to the degradation of fracture strength. The data were also used to assess the applicability of an exposure index (EI), defined as the integral of relative humidity over time, as a means of characterizing an aging history. The fracture strength degradation was measured after aging to achieve a range of EI values, and it was found that the strength loss was independent of the time-humidity path for sufficiently large EI. (C) 2010 Elsevier Ltd. All rights reserved.