Wafer level Cu-Cu direct bonding for 3D integration

被引：39

作者：

Kim, Sarah Eunkyung ^{[1
]}

Kim, Sungdong ^{[2
]}

机构：

[1] Seoul Natl Univ Sci & Technol, Grad Sch NID Fus Technol, Seoul 139743, South Korea

[2] Seoul Natl Univ Sci & Technol, Dept Mech Syst Design Engn, Seoul 139743, South Korea

来源：

MICROELECTRONIC ENGINEERING | 2015年 / 137卷

基金：

新加坡国家研究基金会;

关键词：

3D IC; Wafer-to-wafer; Wafer level stacking; Warpage; Thermo-compression bonding;

D O I：

10.1016/j.mee.2014.12.012

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Wafer level bonding and stacking process for 3D stacked IC was proposed and technical issues were discussed. Cu bumps surrounded by recessed SiO2 were thermo-compression bonded and electrically evaluated using Kelvin structures. Defects at the bonding interface such as voids were responsible for electrical resistance distribution. Wafer alignment during stacking process was found to be affected by several factors like non-uniform bump height, the spacers in a bonding fixture and wafer warpage. Step by step warpage measurement revealed that the wafer warpage was dependent on process steps and worsened at bonding step. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：158 / 163

页数：6

共 19 条

[1] Morphology and bond strength of copper wafer bonding [J].

Chen, KN ;

Tan, CS ;

Fan, A ;

Reif, R .

ELECTROCHEMICAL AND SOLID STATE LETTERS, 2004, 7 (01) :G14-G16

[2]

Cho Young Hak, 2013, [Jornal of the Microelectronics and Packaging Society, 마이크로전자 및 패키징학회지], V20, P7, DOI 10.6117/kmeps.2013.20.1.007

[3] Limits of lithography [J].

Harriott, LR .

PROCEEDINGS OF THE IEEE, 2001, 89 (03) :366-374

[4] Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits [J].

Hwang, Sung-Hwan ;

Kim, Byoung-Joon ;

Lee, Ho-Young ;

Joo, Young-Chang .

JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (02) :232-240

[5] Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs [J].

Jourdain, A. ;

Stoukatch, S. ;

De Moor, P. ;

Ruythooren, W. ;

Pargfrieder, S. ;

Swinnen, B. ;

Beyne, E. .

PROCEEDINGS OF THE IEEE 2007 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2007, :207-+

[6]

Jurgen Wolf M., 2008, EL COMP TECHN C, V1, P1

[7]

Kang Sung-Geun, 2012, [Jornal of the Microelectronics and Packaging Society, 마이크로전자 및 패키징학회지], V19, P29, DOI 10.6117/kmeps.2012.19.2.029

[8]

Kim Eun-Sol, 2012, [Jornal of the Microelectronics and Packaging Society, 마이크로전자 및 패키징학회지], V19, P37, DOI 10.6117/kmeps.2012.19.3.037

[9]

Ko C.-T., 2010, P 3 ELECT SYSTEM INT, P1, DOI [10.1109/ESTC.2010.5642848, DOI 10.1109/ESTC.2010.5642848]

[10] Nanoprodrugs of NSAIDs: Preparation and Characterization of Flufenamic Acid Nanoprodrugs [J].

Lee, Bong-Seop ;

Yoon, ChiWoo ;

Osipov, Arsen ;

Moghavem, Nuriel ;

Nwachokor, Daniel ;

Amatya, Rina ;

Na, Rebekah ;

Pantoja, Joe L. ;

Pham, Michael D. ;

Black, Keith L. ;

Yu, John S. .

JOURNAL OF DRUG DELIVERY, 2011, 2011

← 1 2 →