Electron Velocity Enhancement in Laterally Scaled GaN DH-HEMTs With fT of 260 GHz

被引:72
作者
Shinohara, K. [1 ]
Regan, D. [1 ]
Milosavljevic, I. [1 ]
Corrion, A. L. [1 ]
Brown, D. F. [1 ]
Willadsen, P. J. [1 ]
Butler, C. [1 ]
Schmitz, A. [1 ]
Kim, S. [1 ]
Lee, V. [2 ]
Ohoka, A. [2 ]
Asbeck, P. M. [2 ]
Micovic, M. [1 ]
机构
[1] HRL Labs LLC, Malibu, CA 90265 USA
[2] Univ Calif San Diego, Dept Elect & Comp Engn, San Diego, CA 92093 USA
关键词
Double heterojunction (DH); electron velocity enhancement; GaN; high-electron-mobility transistors (HEMTs); lateral scaling; ohmic regrowth;
D O I
10.1109/LED.2011.2158386
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this letter, we report the first experimental observation of electron velocity enhancement by aggressive lateral scaling of GaN HEMTs. Through reduction of the source-drain distance down to 170 nm using n(+)-GaN ohmic regrowth, 45-nm gate AlN/GaN/Al0.08Ga0.92N HEMTs exhibited an extremely small on resistance of 0.44 Omega . mm, a high maximum drain current density of 2.3 A/mm, a high peak extrinsic transconductance of 905 mS/mm, and a record f(T)/f(max) of 260/394 GHz. Delay time analysis showed that the outstanding f(T) was mainly due to significantly reduced electron transit time at higher drain-source voltages resulting from suppressed drain delay and enhanced electron velocity in the laterally scaled GaN HEMTs.
引用
收藏
页码:1074 / 1076
页数:3
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