High-Voltage Hybrid IGBT Power Modules for Miniaturization of Rolling Stock Traction Inverters

被引:15
作者
Li, Xiang [1 ]
Li, Daohui [1 ]
Chang, Guiqin [2 ]
Gong, Wei [1 ]
Packwood, Matthew [1 ]
Pottage, Daniel [1 ]
Wang, Yangang [1 ]
Luo, Haihui [2 ]
Liu, Guoyou [2 ]
机构
[1] Dynex Semicond Ltd, Res & Dev Ctr, Lincoln LN6 3LF, England
[2] Zhuzhou CRRC Times Semicond Ltd, Res & Dev Ctr, Zhuzhou 412000, Peoples R China
关键词
Silicon carbide; Silicon; Inverters; Insulated gate bipolar transistors; Topology; Substrates; Multichip modules; High-speed railway; insulated-gate bipolar transistors (IGBTs); silicon carbide (SiC); traction inverter; LONG-TERM RELIABILITY;
D O I
10.1109/TIE.2021.3059544
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
A type of 3.3-kV/450-A half-bridge insulated-gate bipolar transistor power module combining the silicon (Si) and silicon carbide (SiC) technologies has been developed and reported in this article, for the miniaturization of the Chinese high-speed railway rolling stock traction inverters. This module is developed by integrating the next-generation industrial standard high-voltage packaging topology and the state-of-the-art 3.3 kV wide bandgap semiconductor chip technology, to reduce the waste power dissipation during operation, which in turn can lead to effective downsizing of key components in the traction inverter design. The module layout characteristics and the SiC Schottky barrier diodes design for substitution of the conventional Si fast recovery diodes will be described in detail. The mechanical, thermal, and electrical performances of the hybrid module are compared comprehensively with the Si-based counterpart. Based on the experimental results, an inverter system level evaluation of both modules is also conducted by electro-thermal simulation. The hybrid module shows advantages in loss reduction leading to great potential of system miniaturization, which is a cost effective solution for massive upgrading of the existing high-speed train traction inverters.
引用
收藏
页码:1266 / 1275
页数:10
相关论文
共 32 条
[1]  
[Anonymous], 2018, Electronics Desktop Help Document
[2]  
[Anonymous], 2020, Mentor Graphics Power Tester Guide
[3]  
[Anonymous], 2020, MECH HELP DOCUMENT
[4]  
[Anonymous], 2020, ICEPAK HELP DOCUMENT
[5]  
Buchberger S., 2015, Peak Water Demand Study: Probability Estimates for Efficient Fixtures in Single and Multi-family Residential Buildings, P1
[6]  
Buticchi G, 2019, IEEE T IND ELECTRON, V66, P5588, DOI 10.1109/TIE.2018.2881951
[7]  
Dai Y, 2018, 2018 19TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME)
[8]  
Gonzalez J. O., 2019, IEEE T IND ELECTRON
[9]  
Huang XJ, 2017, IEEE ENER CONV, P2062, DOI 10.1109/ECCE.2017.8096411
[10]  
Ishikawa K, 2017, Hitachi review, V66, P155