DAMAGE FREE REMOVAL OF NANO-PARTICLES WITH DUAL-FLUID SPRAY NOZZLE CLEANING

被引:0
作者
Teng, Yu [1 ]
Cui, Hushan [2 ]
He, Xiaobin [2 ]
Li, Junjie [2 ]
Han, Jianghao [2 ]
Jiang, Qifeng [2 ]
Liu, Xiaoyan [1 ]
Zhao, Chao [2 ]
Wu, Yi [1 ]
机构
[1] Beijing Sevenstar Elect Co Ltd, Beijing 101312, Peoples R China
[2] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
来源
2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC) | 2016年
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
As continue shrinking of microelectronic device features, removal of nano-particle contaminations is becoming a major challenge in semiconductor manufacturing. After effective wafer cleaning, high particles removal efficiency must be achieved without substrate loss or damage to high aspect ratio structures. In this work, a novel dual-fluid spray nozzle was tested. The cleaning performance with control to normal dispense nozzle was investigated. Also, structural damage tests were carried out on poly-gate-stack line pattern wafers, and compared to the results acquired with megasonic cleaning. The results showed potential applications of such dual-fluid spray nozzle in sub-65nm devices manufacturing.
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页数:3
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