Simulation of Micro ECM for Complex-shaped Holes

被引:12
作者
Mi, Dahai [1 ,2 ]
Natsu, Wataru [1 ]
机构
[1] Tokyo Univ Agr & Technol, 2-24-16 Nakamachi, Koganei, Tokyo 1848588, Japan
[2] Keisoku Engn Syst Co Ltd, Chiyoda Ku, 1-9-5 Uchikanda, Tokyo 1010047, Japan
来源
18TH CIRP CONFERENCE ON ELECTRO PHYSICAL AND CHEMICAL MACHINING (ISEM XVIII) | 2016年 / 42卷
关键词
ECM; Current efficiency; Simulation; Conductive area ratio; Complex-shaped hole;
D O I
10.1016/j.procir.2016.02.186
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
A novel electrochemical machining (ECM) method using tool electrodes with controlled conductive area ratio to shape the complex inner surface of holes was discussed. The machining process was modeled to investigate the electric potential and current density distribution on the electrodes' surface and in the electrolyte, and the evolution of shape of inner surface of the hole. The effect of current efficiency was taken into account when determining the machining velocity of target hole. The relationship between conductive area ratio and the machining depth was also discussed. Simulation results showed that this method is capable of creating reverse-tapered micro holes and holes with various complex internal features with relatively simple control system. (C) 2016 The Authors. Published by Elsevier B.V.
引用
收藏
页码:345 / 349
页数:5
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