Effects of post heat-treatment of electroplating on plating adhesion for TC4 titanium alloys

被引：0

作者：

Xia, YX ^{[1
]}

Li, D ^{[1
]}

机构：

[1] Beijing Univ Aeronaut & Astronaut, Beijing 100083, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2001年 / 30卷 / 05期

关键词：

titanium alloy; electroplating; heat treatment;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effects of the post heat-treatment for electroplating on the adhesion of Ni or Ni/Cu coating were mainly studied in this thesis. The XRD results showed that the diffusion layer was formed between the coating and the base metal after the diffusion treatment, which was mainly consisted of solid solusion or intermetallic compound, such as Ni3Ti, NiTi and NiTi2. There was no direct relationship between the improvement of plating adhesion and the thickness of diffusion layer due to the formation of metallic bonds between the coating and the base metal. The metallic bonds can be easily formed and the plating adhesion can be improved when the integrality of the nonmetallic film, such as oxide film, was destroyed by the solid sulusion and metallic compound in the diffusion layer. The microcosmic clearance between the plating layer and matrix did not increase due to the heat-treatment.

引用

页码：388 / 391

页数：4