Experimental study on silicon micro-heat pipe arrays

被引：72

作者：

Launay, S ^{[1
]}

Sartre, V ^{[1
]}

Lallemand, M ^{[1
]}

机构：

[1] Inst Natl Sci Appl, UMR CNRS 5008, Ctr Therm, F-69621 Villeurbanne, France

来源：

APPLIED THERMAL ENGINEERING | 2004年 / 24卷 / 2-3期

关键词：

micro-heat pipe; silicon; experimental study; effective thermal conductivity; cooling;

D O I：

10.1016/j.applthermaleng.2003.08.003

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

In this study, micro-heat pipe arrays etched into silicon wafers have been investigated for electronic cooling purposes. Micro-heat pipes of triangular cross-section and with liquid arteries were fabricated by wet anisotropic etching with a KOH solution. The microchannels (230 mum wide) are closed by molecular bonding of a plain wafer with the grooved one. A test bench was developed for the micro-heat pipe filling and the thermal characterisation. The temperature profile on the silicon surface is deduced from experimental measurements. The results show that with the artery micro-heat pipe array, filled with methanol, the effective thermal conductivity of the silicon wafer is significantly improved compared to massive silicon. (C) 2003 Elsevier Ltd. All rights reserved.

引用

页码：233 / 243

页数：11

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