Magnitude and location of strain in SMT solder joints

被引：0

作者：

Grossmann, G ^{[1
]}

Affolter, C ^{[1
]}

机构：

[1] Swiss Fed Inst Mat Testing & Res, EMPA, Dubendorf, Switzerland

来源：

MICRO MATERIALS, PROCEEDINGS | 2000年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Reliability prediction of SMT solder joints is based on low cycle fatigue due to cyclic thermomechanical stress. Thus the knowledge of the location and magnitude of the strain induced into a solder joint during thermal cycling is the fundamental requirement for any reliability estimation. In this presentation the deformation behaviour of tin-based solder will be explained, the results of mathematical simulations will be presented and their impact on reliability predictions discussed.

引用

页码：448 / 451

页数：4