Strong effect of Pd concentration on the soldering reaction between Ni and Sn-Pd alloys

被引：14

作者：

Ho, Cheng En ^{[1
]}

Gierlotka, Wojciech ^{[1
]}

Lin, Sheng Wei ^{[1
]}

机构：

[1] Yuan Ze Univ, Dept Chem Engn & Mat Sci, Chungli, Taiwan

来源：

JOURNAL OF MATERIALS RESEARCH | 2010年 / 25卷 / 11期

关键词：

INTERFACIAL REACTIONS; JOINTS; SYSTEM; CU;

D O I：

10.1557/JMR.2010.0268

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effect of Pd concentration on the soldering reaction between Ni and Sn-xPd alloys (x = 0-0.5 wt%) was investigated in this study. When the Pd concentration was low (x <= 0.05 wt%), the predominant reaction product was a layer of Ni(3)Sn(4). In contrast, an additional (Pd,Ni)Sn(4) layer deposited over the Ni(3)Sn(4) in the case of above 0.2 wt%. This microstructure evolution significantly weakened the strength of the interface, deteriorating the reliability of solder joints. A Pd-Ni-Sn isotherm simulated by the CALPHAD method was used to rationalize the above transition in the reaction product(s).

引用

页码：2078 / 2081

页数：4

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