Dislocation substructure-controlled softening of Cu-20Ni-20Mn alloy

被引：14

作者：

Luo, Fuxin ^{[1
]}

Peng, Huaichao ^{[2
]}

Chen, Huiming ^{[1
]}

Xiao, Xiangpeng ^{[1
]}

Xie, Weibin ^{[1
,3
]}

Wang, Hang ^{[1
]}

Yang, Bin ^{[1
]}

机构：

[1] Jiangxi Univ Sci & Technol, Inst Engn Res, Ganzhou 341000, Peoples R China

[2] Jiangxi Univ Sci & Technol, Sch Mat Sci & Engn, Ganzhou 341000, Peoples R China

[3] Jiangxi Yingtan Engn Res Ctr Copper Ind, Yingtan 335000, Peoples R China

来源：

MATERIALS CHARACTERIZATION | 2019年 / 147卷

基金：

中国国家自然科学基金;

关键词：

Copper alloy; Softening; Recovery; Dislocation density; Substructure; MECHANICAL-PROPERTIES; ALUMINUM-ALLOYS; HIGH-STRENGTH; PURE COPPER; MICROSTRUCTURE; EVOLUTION; DEFORMATION; TEMPERATURE; DENSITY;

D O I：

10.1016/j.matchar.2018.11.013

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The dislocation strengthening effect is generally considered to be controlled by dislocation density; however, in the present study the dislocation substructure is shown to play an even more important role for Cu-20Ni-20Mn alloy. The hardness and microstructural evolution during annealing in a hot-forged Cu-20Ni-20Mn alloy are investigated. Microstructure analysis of annealed samples indicated variation in the number of dislocations and dislocation substructure related to softening of the Cu-20Ni-20Mn alloy during static recovery. The tangled dislocations formed a regular array during annealing at 600 degrees C, leading to a high softening fraction of 95%. In addition, rapid dislocation annihilation and sub-boundary disintegration occurred during annealing owing to the dislocation climb at 650 degrees C. The number of mobile dislocations within the grains decreased considerably, leading to softening in the Cu-20Ni-20Mn alloy annealed at 650 degrees C.

引用

页码：253 / 261

页数：9

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