Recommended values for the βSn solidus line in Sn-Bi alloys

被引:26
作者
Belyakov, S. A. [1 ]
Gourlay, C. M. [1 ]
机构
[1] Imperial Coll, Dept Mat, London SW7 2AZ, England
基金
英国工程与自然科学研究理事会;
关键词
Thermal analysis; Phase diagram; Equilibration; Lead-free solder; THERMODYNAMIC ASSESSMENT; SOLDER JOINTS; SYSTEMS; ZN; NI;
D O I
10.1016/j.tca.2017.05.009
中图分类号
O414.1 [热力学];
学科分类号
摘要
Sn-Bi is an industrially important system that is often incorporated into multicomponent solder alloys. Despite a large body of experimental work, the reported data are in significant disagreement over the beta Sn solidus line and maximum solubility of Bi in beta Sn. These inconsistencies are often adopted in thermodynamic assessments and databases and might result in the incorrect design of Bi-containing solders. The present study re-measures the beta Sn solidus line using DSC techniques, explores the origin of the inconsistencies in past measurements, and provides recommended values. The work highlights the importance of the equilibration methods used for solidus measurements and discusses methods to test for full homogenisation.
引用
收藏
页码:65 / 69
页数:5
相关论文
共 28 条
[1]   Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints [J].
Belyakov, S. A. ;
Xian, J. W. ;
Sweatman, K. ;
Nishimura, T. ;
Akaiwa, T. ;
Gourlay, C. M. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 701 :321-334
[2]   The experimental study of the Bi-Sn, Bi-Zn and Bi-Sn-Zn systems [J].
Braga, M. H. ;
Vizdal, J. ;
Kroupa, A. ;
Ferreira, J. ;
Soares, D. ;
Malheiros, L. F. .
CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, 2007, 31 (04) :468-478
[3]   Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate [J].
Chen, Chih-Hao ;
Lee, Boon-Ho ;
Chen, Hsiang-Chua ;
Wang, Chang-Meng ;
Wu, Albert T. .
JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (01) :197-202
[4]  
DELABROUILLE JC, 1969, CR ACAD SCI C CHIM, V268, P884
[5]  
Dinsdale A., 2008, COST 531 LEAD FREE S
[6]  
Dunkerley F. J., 1950, T AM SOC MET, V42, P47
[7]  
GLADKIKH NT, 1987, RUSS METALL+, P173
[8]   ON THE SN-BI-AG TERNARY PHASE-DIAGRAM [J].
KATTNER, UR ;
BOETTINGER, WJ .
JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :603-610
[9]   Thermodynamic assessments of the Sn-In and Sn-Bi binary systems [J].
Lee, BJ ;
Oh, CS ;
Shim, JH .
JOURNAL OF ELECTRONIC MATERIALS, 1996, 25 (06) :983-991
[10]  
Lepkowski W., 1908, Z ANORG CHEM, V59, P285