Stretchable and foldable silicon integrated circuits

被引:1435
作者
Kim, Dae-Hyeong [4 ,5 ]
Ahn, Jong-Hyun [6 ]
Choi, Won Mook [4 ,5 ]
Kim, Hoon-Sik [4 ,5 ]
Kim, Tae-Ho [4 ,5 ]
Song, Jizhou [7 ]
Huang, Yonggang Y. [1 ,2 ]
Liu, Zhuangjian [3 ]
Lu, Chun [3 ]
Rogers, John A. [4 ,5 ,7 ,8 ,9 ]
机构
[1] Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
[2] Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA
[3] Inst High Performance Comp, Singapore 117528, Singapore
[4] Univ Illinois, Dept Mat Sci & Engn, Beckman Inst, Urbana, IL 61801 USA
[5] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
[6] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 440746, South Korea
[7] Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA
[8] Univ Illinois, Dept Chem, Urbana, IL 61801 USA
[9] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
关键词
D O I
10.1126/science.1154367
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
We have developed a simple approach to high- performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and "wavy" structural configurations in silicon complementary logic gates, ring oscillators, and differential amplifiers. We performed three- dimensional analytical and computational modeling of the mechanics and the electronic behaviors of these integrated circuits. Collectively, the results represent routes to devices, such as personal health monitors and other biomedical devices, that require extreme mechanical deformations during installation/ use and electronic properties approaching those of conventional systems built on brittle semiconductor wafers.
引用
收藏
页码:507 / 511
页数:5
相关论文
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