Wafer defect detection method based on machine vision

With the development of integrated electronic circuit manufacturing technology, enterprises have put forward higher requirements for the quality of silicon chips. Aiming at the low efficiency of silicon wafer defect detection, this paper proposes an automatic defect detection method based on machine vision. The voiding algorithm based on flood fill can effectively extract the inner contour information of the wafer profile. A rotation correction algorithm is proposed to correct the wafer yaw angle. The actual wafer was used to verify the performance of the proposed method. The results show that the proposed method is effective in detection accuracy.