Galvanostatic and potentiostatic deposition of bismuth telluride films from nitric acid solution: effect of chemical and electrochemical parameters

被引:70
作者
Michel, S [1 ]
Diliberto, S [1 ]
Boulanger, C [1 ]
Stein, N [1 ]
Lecuire, JM [1 ]
机构
[1] Univ Metz, CNRS, UMR 7555, Lab Electrochim Mat, F-57078 Metz, France
关键词
electrochemical growth; bismuth compounds; semiconducting materials;
D O I
10.1016/j.jcrysgro.2004.12.164
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Composition modulated Bi(2)Te(3) thin films have been deposited onto stainless-steel substrates using a potentiostatic or a galvanostatic process. The deposition potentials and current densities for different bath compositions and concentrations have been estimated from voltamperometric curves. Solutions with two Bi/Te ratios were studied. Only Bi(3+) and HTeO(2)(+) solutions in the volumetric proportion of 1:1 with equimolar solution concentrations of 0.01, 0.015 or 0.02 M allow one to obtain films with an excess or a deficiency of Bi in relation to stoichiometric BiTe(3) (Bi = 40 at%, Te = 60 at%) by changing the deposition potential or the current density. The structure and the morphology of films have been studied as a function of the electrolyte concentration and the deposition conditions. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:274 / 283
页数:10
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