200 V GaN-on-SOI Smart Power Platform for Monolithic GaN Power ICs

被引:18
作者
Cosnier, T. [1 ]
Syshchyk, O. [1 ,2 ]
De Jaeger, B. [1 ]
Geens, K. [1 ]
Cingu, D. [1 ]
Fabris, Elena [1 ]
Borga, M. [1 ]
Vohra, A. [1 ]
Zhao, M. [1 ]
Bakeroot, B. [1 ,3 ]
Wellekens, D. [1 ]
Magnani, A. [1 ]
Vudumula, P. [2 ]
Chatterjee, U. [1 ]
Langer, R. [1 ]
Decoutere, S. [1 ]
机构
[1] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
[2] Katholieke Univ Leuven, Dept Elect Engn, Leuven, Belgium
[3] Univ Ghent, Ghent, Belgium
来源
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2021年
关键词
D O I
10.1109/IEDM19574.2021.9720591
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper demonstrates a 200 V GaN-on-SOI smart power integrated circuits (ICs) platform developped on 200 mm substrates. Depletion-mode (d-mode) MIS-HEMTs and Gated-Edge-Termination Schottky barrier diodes (GET-SBDs) have been successfully integrated in an enhancement-mode (e-mode) HEMT technology baseline. A variety of low-voltage analog/logic devices and passive components further supports the GaN ICs platform. These results significantly contribute to monolithic GaN integration for power ICs and create key opportunities for the development of GaN power circuits and complex converter topologies.
引用
收藏
页数:4
相关论文
共 7 条
[1]   Reliability Improvements in AlGaN/GaN Schottky Barrier Diodes With a Gated Edge Termination [J].
Acurio, Eliana ;
Crupi, Felice ;
Ronchi, Nicolo ;
De Jaeger, Brice ;
Bakeroot, Benoit ;
Decoutere, Stefaan ;
Trojman, Lionel .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 65 (05) :1765-1770
[2]  
Li X., 2019, IEEE INT ELECT DEV M, P78, DOI [10.1109/IEDM19573.2019.8993572, DOI 10.1109/IEDM19573.2019.8993572]
[3]   Suppression of the Backgating Effect of Enhancement-Mode p-GaN HEMTs on 200-mm GaN-on-SOI for Monolithic Integration [J].
Li, Xiangdong ;
Van Hove, Marleen ;
Zhao, Ming ;
Geens, Karen ;
Guo, Weiming ;
You, Shuzhen ;
Stoffels, Steve ;
Lempinen, Vesa-Pekka ;
Sormunen, Jaakko ;
Groeseneken, Guido ;
Decoutere, Stefaan .
IEEE ELECTRON DEVICE LETTERS, 2018, 39 (07) :999-1002
[4]  
Moench S, 2019, 2019 IEEE 7TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA 2019), P28, DOI [10.1109/wipda46397.2019.8998934, 10.1109/WiPDA46397.2019.8998934]
[5]  
Posthuma NE, 2018, PROC INT SYMP POWER, P284, DOI 10.1109/ISPSD.2018.8393658
[6]   GaN Power ICs: Reviewing Strengths, Gaps, and Future Directions [J].
Trescases, O. ;
Murray, S. K. ;
Jiang, W. L. ;
Zaman, M. S. .
2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2020,
[7]  
Zhang L, 2020, PROC INT SYMP POWER, P521, DOI [10.1109/ISPSD46842.2020.9170075, 10.1109/ispsd46842.2020.9170075]