ELASTOCALORIC HEAT PUMPING USING A SHAPE MEMORY ALLOY FOIL DEVICE

被引：0
作者：
Ossmer, H. [1 ]
Miyazaki, S. [2 ]
Kohl, M. [1 ]
机构：
[1] Karlsruhe Inst Technol, Karlsruhe, Germany
[2] Univ Tsukuba, Tsukuba, Ibaraki, Japan
来源：
2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2015年
关键词：
Shape memory alloy; TiNi; superelasticity; elastocaloric effect; heat pumping;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper explores, develops and demonstrates a miniature heat pump based on the elastocaloric effect in shape memory alloys (SMAs). The active material is a Ti50.5Ni49.1Fe0.4 foil of 30 mu m thickness showing a maximum temperature change during pseudoelastic loading/unloading up to +20/-16 K. This effect is implemented in a heat pump design consisting of SMA bridge, heat source and sink. First-of-its-kind demonstrators reveal a temperature difference between source and sink of about 7 K after 100 s for a ratio of heat capacities of SMA bridge and heat source of 1:85. The coefficient of performance (COP) of the device for cooling is 2.8 whereas the theoretical COP of the material is 10.5.
引用
收藏
页码：726 / 729
页数：4
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