Compact double-side liquid-impingement-cooled integrated power electronic module

被引：30

作者：

Johnson, C. M. ^{[1
]}

Buttay, C. ^{[1
]}

Rashid, S. J. ^{[2
]}

Udrea, F. ^{[2
]}

Amaratunga, G. A. J. ^{[2
]}

Ireland, P. ^{[3
]}

Malhan, R. K. ^{[4
]}

机构：

[1] Univ Nottingham, Sch Elect & Elect Engn, Univ Pk, Nottingham NG7 2RD, England

[2] Univ Cambridge, Dept Engn, Elect Engn Div, Cambridge CB3 0FA, England

[3] Univ Oxford, Dept Engn Sci, Oxford OX1 3PJ, England

[4] DENSO CORP, Res Lab, Aichi 4700111, Japan

来源：

PROCEEDINGS OF THE 19TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS | 2007年

基金：

英国工程与自然科学研究理事会;

关键词：

D O I：

10.1109/ISPSD.2007.4294930

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, dc-link capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper.

引用

页码：53 / +

页数：2

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