Development of a silicon carbide ceramic based counter-flow heat exchanger by binder jetting and liquid silicon infiltration for concentrating solar power

被引:25
作者
Thomas, Jonova [1 ]
Banda, Mahesh [1 ]
Du, Wenchao [1 ]
Yu, Wenhua [1 ]
Chuang, Andrew [2 ]
France, David M. [1 ]
Singh, Dileep [1 ]
机构
[1] Argonne Natl Lab, Appl Mat Div, Lemont, IL 60439 USA
[2] Argonne Natl Lab, Xray Sci Div, Lemont, IL 60439 USA
关键词
Heat exchanger; Silicon carbide; Liquid silicon infiltration; Binder jetting; Additive manufacturing; Concentrating solar power; THERMAL-CONDUCTIVITY; FABRICATION; MICROSTRUCTURE; COMPOSITES;
D O I
10.1016/j.ceramint.2022.04.269
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A silicon carbide ceramic counter-flow heat exchanger with integrated headers was printed by binder jetting additive manufacturing process. Multiple phenolic binder infiltration cycles (3 or 5) followed by pyrolysis were conducted to increase the net carbon content of the printed SiC specimens. Subsequently, to attain full densification, silicon melt infiltration was used. The microstructure and mechanical properties were comprehensively characterized on the densified material. The chemical compositions and visual distribution of the various regions in the specimens were determined via scanning electron microscopy, while X-ray diffraction and synchrotron mu-computed tomography were used to provide a quantitative assessment of the volume fractions of the identified phase regions. Microhardness measurements showed dependence on the local microstructure. The fracture strength of the material was correlated with the specimen density and agreed with the reported values in the literature. High-temperature exposure at 750 degrees C for up to 200 h did not degrade the strength for the specimens with three phenolic-binder infiltrations; however, the strengths degraded for ones with five phenolic-binder infiltrations. The associated fracture toughnesses of the specimens were -3.4 MPam1/2 at room temperature and 750 degrees C, and the thermal conductivities varied from >150 W/mK at room temperature to -45 W/mK at 750 degrees C. Hence, this study validated the use of the binder-jetting printed SiC ceramic materials for hightemperature heat exchanges. Finally, we also present in this work the first successful fabrication of a binderjetting printed one-piece dense SiC ceramic heat exchanger body with unblocked channels that can be used for the flow of heat transfer fluids.
引用
收藏
页码:22975 / 22984
页数:10
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