Mechanical Performance of SiC based MEMS Capacitive Microphone for Ultrasonic Detection in Harsh Environment

被引:4
作者
Zawawi, S. A. [1 ,3 ]
Hamzah, A. A. [1 ]
Mohd-Yasin, F. [2 ]
Majlis, B. Y. [1 ]
机构
[1] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect IMEN, Bangi 43600, Selangor, Malaysia
[2] Griffith Univ, Queensland Micro & Nanotechnol Ctr, Nathan, Qld 4111, Australia
[3] Univ Teknol Mara, UiTM Fdn Ctr, Campus Dengkil, Dengkil 43800, Selangor, Malaysia
来源
NANOENGINEERING: FABRICATION, PROPERTIES, OPTICS, AND DEVICES XIV | 2017年 / 10354卷
关键词
Silicon carbide; MEMS capacitive microphone; ultrasonic detection; CONDENSER MICROPHONE; SILICON MICROPHONE; HIGH-SENSITIVITY; DIAPHRAGM; BACKPLATE; FABRICATION; MEMBRANES; ELECTRET; DESIGN; PLATE;
D O I
10.1117/12.2273717
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this project, SiC based MEMS capacitive microphone was developed for detecting leaked gas in extremely harsh environment such as coal mines and petroleum processing plants via ultrasonic detection. The MEMS capacitive microphone consists of two parallel plates; top plate (movable diaphragm) and bottom (fixed) plate, which separated by an air gap. While, the vent holes were fabricated on the back plate to release trapped air and reduce damping. In order to withstand high temperature and pressure, a 1.0 mu m thick SiC diaphragm was utilized as the top membrane. The developed SiC could withstand a temperature up to 1400 degrees C. Moreover, the 3 mu m air gap is invented between the top membrane and the bottom plate via wafer bonding. COMSOL Multiphysics simulation software was used for design optimization. Various diaphragms with sizes of 600 mu m(2), 700 mu m(2), 800 mu m(2), 900 mu m(2) and 1000 mu m(2) are loaded with external pressure. From this analysis, it was observed that SiC microphone with diaphragm width of 1000 mu m(2) produced optimal surface vibrations, with first-mode resonant frequency of approximately 36 kHz. The maximum deflection value at resonant frequency is less than the air gap thickness of 8 mu m, thus eliminating the possibility of shortage between plates during operation. As summary, the designed SiC capacitive microphone has high potential and it is suitable to be applied in ultrasonic gas leaking detection in harsh environment.
引用
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页数:7
相关论文
共 36 条
[1]  
Bandana L., 2016, IJSR, P2319
[2]   Micromachined double backplate differential capacitive microphone [J].
Bay, J ;
Hansen, O ;
Bouwstra, S .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1999, 9 (01) :30-33
[3]   Design of a silicon microphone with differential read-out of a sealed double parallel-plate capacitor [J].
Bay, J ;
Hansen, O ;
Bouwstra, S .
SENSORS AND ACTUATORS A-PHYSICAL, 1996, 53 (1-3) :232-236
[4]   A SILICON CONDENSER MICROPHONE USING BOND AND ETCH-BACK TECHNOLOGY [J].
BERGQVIST, J ;
RUDOLF, F .
SENSORS AND ACTUATORS A-PHYSICAL, 1994, 45 (02) :115-124
[5]   A new hybrid fabrication process for a high sensitivity MEMS microphone [J].
Chao, Paul C. -P. ;
Tsai, Chun-Yin ;
Chiu, Chi-Wei ;
Tsai, Che-Hung ;
Tu, Tse-Yi .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (9-10) :1425-1431
[6]   On the single-chip condenser miniature microphone using DRIE and backside etching techniques [J].
Chen, J ;
Liu, LT ;
Li, ZJ ;
Tan, ZM ;
Xu, Y ;
Ma, J .
SENSORS AND ACTUATORS A-PHYSICAL, 2003, 103 (1-2) :42-47
[7]  
Elwenspoek M., 2001, MECH MICROSENSORS
[8]  
Ganji BA, 2011, CRYSTALLINE SILICON - PROPERTIES AND USES, P313
[9]   Slotted capacitive microphone with sputtered aluminum diaphragm and photoresist sacrificial layer [J].
Ganji, Bahram Azizollah ;
Majlis, Burhanuddin Yeop .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2010, 16 (10) :1803-1809
[10]   High sensitivity and small size MEMS capacitive microphone using a novel slotted diaphragm [J].
Ganji, Bahram Azizollah ;
Majlis, Burhanuddin Yeop .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (09) :1401-1406