Influence of surface recombination on the burn-in effect in microwave GaInP/GaAs HBT's

被引:24
作者
Borgarino, M [1 ]
Plana, R
Delage, SL
Fantini, F
Graffeuil, J
机构
[1] Univ Parma, Dipartimento Ingn Informaz, I-43100 Parma, Italy
[2] CNRS, Lab Anal & Architecture Syst, F-31077 Toulouse 4, France
[3] Thomson LCR, F-91404 Orsay, France
[4] Univ Modena, Dipartimento Sci Ingn, I-41100 Modena, Italy
关键词
D O I
10.1109/16.737435
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we report on the early increase of the de current gain (burn-in effect) due to the electrical stress of carbon doped GaInP/GaAs heterojunction bipolar transistors (HBT's). Devices featuring different passivation layers, base doping, and emitter widths were investigated. The obtained data demonstrate that the burn-in effect is due to a reduction of the surface recombination located at the extrinsic base surface, around the emitter perimeter. It is concluded that the recombination centers are related to defects at the passivation/semiconductor interface and that, during the stress, they are passivated by hydrogen atoms released from C-H complexes.
引用
收藏
页码:10 / 16
页数:7
相关论文
共 21 条
[1]  
ALBERNATHY CR, 1989, APPL PHYS LETT, V55, P1750
[2]  
ANHOLT RE, 1995, ELECT THERMAL CHARAC, pCH4
[3]   Reliability investigation of InGaP/GaAs heterojunction bipolar transistors [J].
Bahl, SR ;
Camnitz, LH ;
Houng, D ;
Mierzwinski, M .
IEEE ELECTRON DEVICE LETTERS, 1996, 17 (09) :446-448
[4]  
BORGARINO M, 1996, P EDMO, P37
[5]  
BORGARINO M, 1997, P EDMO WORKSH, P43
[6]   RESOLVING DEGRADATION MECHANISMS IN ULTRA-HIGH PERFORMANCE N-P-N HETEROJUNCTION BIPOLAR-TRANSISTORS [J].
CHANG, YH ;
LI, GP .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (04) :692-697
[7]  
CHI JY, 1997, P 1997 GAAS REL WORK, P7
[8]  
DAUTREMONTSMITH WC, 1986, APPL PHYS LETT, V49, P17
[9]  
FUSHIMI H, 1996, P IRPS, P214
[10]   THE EFFECTS OF BASE DOPANT DIFFUSION ON DC AND RF CHARACTERISTICS OF INGAAS/INALAS HETEROJUNCTION BIPOLAR-TRANSISTORS [J].
HAFIZI, M ;
METZGER, RA ;
STANCHINA, WE ;
RENSCH, DB ;
JENSEN, JF ;
HOOPER, WW .
IEEE ELECTRON DEVICE LETTERS, 1992, 13 (03) :140-142