Numerical study of capacitive coupled HBr/Cl2 plasma discharge for dry etch applications

被引:11
|
作者
Gul, Banat [1 ]
Ahmad, Iftikhar [1 ,2 ]
Zia, Gulfam [3 ]
Aman-ur-Rehman [1 ,3 ]
机构
[1] Pakistan Inst Engn & Appl Sci, Dept Phys & Appl Math, Islamabad 45650, Pakistan
[2] Ctr Nucl Med & Radiotherapy, Quetta, Pakistan
[3] Pakistan Inst Engn & Appl Sci, Dept Nucl Engn, Islamabad 45650, Pakistan
关键词
ZNO THIN-FILMS; TRANSPORT-COEFFICIENTS; CROSS-SECTIONS; MECHANISM; CHEMISTRY; MODEL;
D O I
10.1063/1.4962570
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
HBr/Cl-2 plasma discharge is investigated to study the etchant chemistry of this discharge by using the self-consistent fluid model. A comprehensive set of gas phase reactions (83 reactions) including primary processes such as excitation, dissociation, and ionization are considered in the model along with 24 species. Our findings illustrate that the densities of neutral species (i.e., Br, HCl, Cl, H, and H-2) produced in the reactor are higher than charged species (i.e., Cl-2(+), Cl-, HBr+, and Cl+). Density profile of neutral and charged species followed bell shaped and double humped distributions, respectively. Increasing Cl-2 fraction in the feedback gases (HBr/Cl-2 from 90/10 to 10/90) promoted the production of Cl, Cl+, and Cl-2(+) in the plasma, indicating that chemical etching pathway may be preferred at high Cl-environment. These findings pave the way towards controlling/optimizing the Si-etching process. Published by AIP Publishing.
引用
收藏
页数:9
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