A 76-to 81-GHz Packaged Single-Chip Transceiver for Automotive Radar

被引：0

作者：

Fujibayashi, Takeji ^{[1
,2
]}

Takeda, Yohsuke ^{[1
,2
]}

Wang, Weihu ^{[1
]}

Yeh, Yi-Shin ^{[1
]}

Stapelbroek, Willem ^{[2
]}

Takeuchi, Seiji ^{[2
]}

Floyd, Brian ^{[1
]}

机构：

[1] North Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA

[2] Asahi Kasei Microdevices Corp, Atsugi, Kanagawa, Japan

来源：

2016 IEEE BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING (BCTM) | 2016年

关键词：

77; GHz; radar; transceiver; FMCW; receiver; transmitter; SiGe; built-in self test; W band;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a flip-chip packaged 76- to 81-GHz transceiver chip implemented in SiGe BiCMOS technology for both long-range and short-range automotive radar applications. The single chip contains a two-channel transmitter with +18-dBm saturated output power per channel; an LO chain with x4 multiplier, wide-band 20-GHz VCO with -100-dBc/Hz phase noise at 1-MHz offset referenced to a 77-GHz carrier, and divide-by-four prescaler; and a six-channel receiver with 10- to 11-dB noise figure, 14- to 15-dB conversion gain and +1-dBm input P-ldB in unpackaged condition. The interconnect loss through the BGA package at 80 GHz is 1.5 to 2 dB. Built-in self-test (BIST) circuits are integrated to enable RF output power, receiver gain, relative channel-to-channel phase and internal temperature measurement.

引用

页码：166 / 169

页数：4

共 6 条

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[2] Schneider M., 2005, P GERM MICR C GEMIC, V5-3, P144
[3] Takeda Y, 2014, IEEE MTT S INT MICR
[4] An RCP Packaged Transceiver Chipset for Automotive LRR and SRR Systems in SiGe BiCMOS Technology
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[6] Wang WH, 2014, 2014 IEEE 14TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), P104, DOI 10.1109/SiRF.2014.6828522

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