Implementing commercial processes into the design of space electronics is a desirable, cost-effective way to leverage existing advanced packaging technologies derived from consumer electronics products. Demands for faster, better, lighter, and cheaper products have led to many innovative designs in commercial electronics, most noticeably in the telecommunications sector. But directly employing commercial processes in space applications, although cost-effective, is extremely risky. Therefore, careful studies and planning are critical to ensure the survivability of commercial processes throughout the space mission and full functionality under severe space environments. With many years of experience in developing high-reliability electronics, the APL Space Department began evaluating, qualifying, and developing commercial processes for space applications with chip-on-board (COB) technology We have successfully demonstrated that our in-house fabrication and coating process can improve existing commercial COB technology to meet the stringent qualifications for space environments. Recently, we have focused on advanced interconnect methods such as flip chip technology and high-density printed wiring board development with blind and buried micro vias. These ongoing studies have demonstrated great potential for future space applications for both one-of-a-kind and build-to-print production runs.
