Hybrid 3D Printing of Soft Electronics

被引:571
作者
Valentine, Alexander D. [1 ]
Busbee, Travis A. [1 ]
Boley, John William [1 ]
Raney, Jordan R. [1 ]
Chortos, Alex [1 ]
Kotikian, Arda [1 ]
Berrigan, John Daniel [2 ]
Durstock, Michael F. [2 ]
Lewis, Jennifer A. [1 ]
机构
[1] Pierce Hall Rm 221,29 Oxford St, Cambridge, MA 02138 USA
[2] US Air Force, Res Lab, Mat & Mfg Directorate, Soft Mat Branch, Wright Patterson AFB, OH 45433 USA
关键词
conductive elastomers; multimaterial 3D printing; pick-and-place; soft sensors; PRINTABLE ELASTIC CONDUCTORS; HUMAN-MOTION DETECTION; STRAIN SENSORS; CARBON NANOTUBES; LARGE-AREA; ARTIFICIAL SKIN; MATRIX; TRANSPARENT; CIRCUITS; SILVER;
D O I
10.1002/adma.201703817
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Hybrid 3D printing is a new method for producing soft electronics that combines direct ink writing of conductive and dielectric elastomeric materials with automated pick-and-place of surface mount electronic components within an integrated additive manufacturing platform. Using this approach, insulating matrix and conductive electrode inks are directly printed in specific layouts. Passive and active electrical components are then integrated to produce the desired electronic circuitry by using an empty nozzle (in vacuum-on mode) to pick up individual components, place them onto the substrate, and then deposit them (in vacuum-off mode) in the desired location. The components are then interconnected via printed conductive traces to yield soft electronic devices that may find potential application in wearable electronics, soft robotics, and biomedical devices.
引用
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页数:8
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