Fabrication of 3D Comb Drive Microscanners by mechanically induced permanent Displacement

被引：6
作者：
Jung, D. [1 ]
Kallweit, D. [1 ]
Sandner, T. [1 ]
Conrad, H. [1 ]
Schenk, H. [1 ]
Lakner, H. [1 ]
机构：
[1] Fraunhofer Inst Photon Microsyst, D-01109 Dresden, Germany
来源：
MOEMS AND MINIATURIZED SYSTEMS VIII | 2009年 / 7208卷
关键词：
microscanner; vertical comb drive; AVC; SVC; quasi static scanning; solid body mechanism; w2w bonding; ACTUATORS;
D O I：
10.1117/12.808210
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
A technology approach is presented which enables an initial permanent counter electrode deflection of planar out of plane comb drive actuators allowing quasistatic operation of an electrostatic microscanner. The device is assembled by mounting a top wafer with salient stamps onto a mirror wafer. The commonly fix in plane counter electrode parts on the mirror wafer are connected to deflectable platforms via a mechanical structure of coupled hinges. During the wafers assembly the down pressing stamps displace the platforms and result in a predefined permanent out of plane counter comb deflection.
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页数：11
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