Parallel-in-time-and-space electromagnetic transient simulation of multi-terminal DC grids with device-level switch modelling

被引：1

作者：

Cheng, Tianshi ^{[1
]}

Lin, Ning ^{[1
]}

Liang, Tian ^{[1
]}

Dinavahi, Venkata ^{[1
]}

机构：

[1] Univ Alberta, Dept Elect & Comp Engn, Edmonton, AB T6G 1H9, Canada

来源：

IET GENERATION TRANSMISSION & DISTRIBUTION | 2022年 / 16卷 / 01期

基金：

加拿大自然科学与工程研究理事会;

关键词：

MODULAR MULTILEVEL CONVERTER; POWER-SYSTEM; IMPLEMENTATION; MMCS; AC;

D O I：

10.1049/gtd2.12285

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The electromagnetic transient (EMT) simulation of multi-terminal DC (MTDC) grids requires a detailed device-level modular multilevel converter (MMC) model, which can have thousands of state variables and complex internal structures. The fast device-level insulated gate bipolar transistor (IGBT) transient requires a very small time-step, making the computational overhead prohibitive. Based on the analysis of the parallel-in-time (PiT) implementation of detailed modelled MMCs, this paper proposes a task-based hybrid PiT algorithm to achieve high parallel efficiency and speed-up of MMC with device-level modelling. Moreover, a transmission line model(TLM)-based parallel-in-time-and-space (PiT+PiS) method is proposed to connect PiT grids to conventional or other PiT grids and exploit the maximum parallelism. Simulation results show greater than 30x speed-up and 60% parallel efficiency on a 48 cores computer for the hybrid PiT method in a 201-level three-phase MMC test case, and 20x speed-up in the transient simulation of CIGRe B4 DC grid test system for the PiT+PiS method.

引用

页码：149 / 162

页数：14

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