In situ imaging of hole shape evolution in ultrashort pulse laser drilling

被引：52
|
作者：
Doering, Sven [1 ]
Richter, Soeren [1 ]
Nolte, Stefan [1 ,2 ]
Tuennermann, Andreas [1 ,2 ]
机构：
[1] Univ Jena, Inst Appl Phys, D-07743 Jena, Germany
[2] Fraunhofer Inst Appl Opt & Precis Engn, D-07745 Jena, Germany
来源：
OPTICS EXPRESS | 2010年 / 18卷 / 19期
关键词：
ABLATION; METALS; FEMTOSECOND; PLASMA; SPEED; MORPHOLOGY; DYNAMICS;
D O I：
10.1364/OE.18.020395
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
For the first time, in situ the hole shape evolution during ultrashort pulse laser drilling in semiconductor material is imaged. The trans-illumination of the sample at a wavelength of 1.06 mu m is projected onto a standard CCD camera during the ablation, providing an image of the contour of the ablated structure perpendicular to the irradiation for drilling. This demonstrated technique enables a direct, high resolution investigation of the temporal evolution of the drilling process in the depth of the material without complex sample preparation or post processing. (C) 2010 Optical Society of America
引用
收藏
页码：20395 / 20400
页数：6
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