The dissimilar AA6063/AA7075 plate was fabricated by porthole die co-extrusion method, and the effects of extrusion temperature on microstructure and mechanical properties were investigated. The results showed that the sound AA6063/AA7075 welding interface without crack or impurity was obtained. Few secondary particles existed in extruded AA6063 side, while large amount of fine particles were found in AA7075 side, and the number of particles was decreased with increasing temperature. The coarse initial grains with the formation of substructures were observed in AA6063. However, the microstructure of AA7075 mainly consisted of fine equiaxed grains with several microns due to the occurrence of near complete dynamic recrystallization. The average grains size of the AA6063/AA7075 extruded plate was increased with increasing temperature. The plate extruded at 510 degrees C has strong texture component with 10 degrees shift of Phi from Cube and some weak recrystallization Cube texture. The elongation was not affected by temperature, while the hardness and ultimate tensile strength were obviously enhanced with increasing temperature. (C) 2018 Elsevier B.V. All rights reserved.
机构:
Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
State Key Lab Tribol, Beijing 100084, Peoples R ChinaTsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
Bai, Sheng-Wen
Fang, Gang
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Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
State Key Lab Tribol, Beijing 100084, Peoples R ChinaTsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
Fang, Gang
Zhou, Jie
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Delft Univ Technol, Dept Biomech Engn, NL-2628 CD Delft, NetherlandsTsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
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Indian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, IndiaIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
Dinda, Soumitra Kumar
Warnett, Jason M.
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Univ Warwick, WMG, Coventry CV4 7AL, W Midlands, EnglandIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
Warnett, Jason M.
Williams, Mark A.
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Univ Warwick, WMG, Coventry CV4 7AL, W Midlands, EnglandIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
Williams, Mark A.
Roy, Gour Gopal
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Indian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, IndiaIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
机构:
Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
State Key Lab Tribol, Beijing 100084, Peoples R ChinaTsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
Bai, Sheng-Wen
Fang, Gang
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h-index: 0
机构:
Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
State Key Lab Tribol, Beijing 100084, Peoples R ChinaTsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
Fang, Gang
Zhou, Jie
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机构:
Delft Univ Technol, Dept Biomech Engn, NL-2628 CD Delft, NetherlandsTsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
机构:
Indian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, IndiaIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
Dinda, Soumitra Kumar
Warnett, Jason M.
论文数: 0引用数: 0
h-index: 0
机构:
Univ Warwick, WMG, Coventry CV4 7AL, W Midlands, EnglandIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
Warnett, Jason M.
Williams, Mark A.
论文数: 0引用数: 0
h-index: 0
机构:
Univ Warwick, WMG, Coventry CV4 7AL, W Midlands, EnglandIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
Williams, Mark A.
Roy, Gour Gopal
论文数: 0引用数: 0
h-index: 0
机构:
Indian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, IndiaIndian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India