Photo-induced growth of dielectrics with excimer lamps

被引:67
作者
Boyd, IW
Zhang, JY
机构
[1] UCL, London WC1E 7JE, England
[2] Univ Sci & Technol China, Struct Res Lab, Hefei 230026, Peoples R China
基金
英国工程与自然科学研究理事会;
关键词
photo-CVD; excimer lamp; UV annealing; thin Ta2O5 film; dielectric constant; sol-gel processing; semiconductor devices;
D O I
10.1016/S0038-1101(00)00259-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The underlying principles and properties of vacuum ultraviolet (VUV) and ultraviolet (UV) radiation (excimer lamps), generated by a dielectric barrier discharge in a rare-gas (Rg) or a mixture of Rg and halogen, are discussed. Compared with conventional sources, these excimer lamps offer narrow-band radiation at various wavelengths from 108-354 nm and over large areas with high efficiencies and high power densities. The variety of available wavelengths offers an enormous potential for new industrial applications in materials processing. Previously, photo-oxidation of silicon, germanium and silicon-germanium and photo-deposition of single- and multi-layered films of silicon oxide, silicon nitride, and silicon oxynitride have been demonstrated by using excimer lamps. This paper reviews the progress on excimer lamp-assisted growth of high dielectric constant (Ta2O5, TiO2 and PZT) and low dielectric constant (polyimide and porous silica) thin films by photo-CVD and sol-gel processing, summarizes the properties of photoinduced growth of Ta2O5 films and discusses the effect and mechanism of low temperature UV annealing with 172 nm radiation. Metal oxide semiconductor capacitors based on the photo-induced Ta2O5 films grown directly on Si at low temperatures exhibit excellent electrical properties. Leakage current densities as low as 5.2 x 10(-7) A cm(-2) and 2.41 x 10(-7) A cm(-2) at 1 MV cm(-1) have been achieved for the as-grown Ta2O5 films deposited by photo-induced sol-gel processing and photo-CVD, respectively-several orders of magnitude lower than for any other as-grown films prepared by any other technique, A subsequent low temperature (400 degreesC) UV annealing step improves these to 10(-8) A cm(-2). These values are comparable to those only previously achieved for films annealed at high temperatures between 600 degreesC and 1000 degreesC. These properties make the photo-induced growth of Ta2O5 layers suitable alternative to SiO2 for high density DRAM application. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:1413 / 1431
页数:19
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