A PAM4 Dielectric Waveguide Link in 28 nm CMOS

被引:38
作者
Dens, Kristof [1 ]
Vaes, Joren [1 ]
Ooms, Simon [1 ]
Wagner, Martin [2 ]
Reynaert, Patrick [1 ]
机构
[1] Katholieke Univ Leuven, Dept Elektrotech ESAT MICAS, Leuven, Belgium
[2] HUBER SUHNER AG, Herisau, Switzerland
来源
ESSCIRC 2021 - IEEE 47TH EUROPEAN SOLID STATE CIRCUITS CONFERENCE (ESSCIRC) | 2021年
关键词
CMOS; dielectric waveguide (DWG); millimeter-wave (mm-wave); polymer microwave fiber (PMF); amplitude shift keying (ASK); PAM4;
D O I
10.1109/ESSCIRC53450.2021.9567741
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents a dielectric waveguide communication link at 135 GHz, reaching 27 Gb/s non-return to-zero (NRZ) communication without any equalization at a bit-error-rate (BER) below 10(-12) and up to 50 Gb/s 4-level pulse-amplitude modulation (PAM4) over 3 m of fiber at a BER below 10 -6 when equalization is applied. This work is the first to break the 25 Gb/s barrier at distances of 1 m and above. These results are achieved by combining a low power, multilevel mm-wave transceiver with a coupler on printed circuit board (PCB) and a fiber design optimized for low dispersion.
引用
收藏
页码:479 / 482
页数:4
相关论文
共 5 条
[1]   Analysis and Design of a Foam-Cladded PMF Link With Phase Tuning in 28-nm CMOS [J].
De Wit, Maxime ;
Zhang, Yang ;
Reynaert, Patrick .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2019, 54 (07) :1960-1969
[2]   A Millimeter-Wave CMOS Transceiver With Digitally Pre-Distorted PAM-4 Modulation for Contactless Communications [J].
Kim, Yanghyo ;
Hu, Boyu ;
Du, Yuan ;
Cho, Wei-Han ;
Huang, Rulin ;
Tang, Adrian ;
Chen, Huan-Neng ;
Jou, Chewnpu ;
Cong, Jason ;
Itoh, Tatsuo ;
Chang, Mau-Chung Frank .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2019, 54 (06) :1600-1612
[3]   High-Speed mm-Wave Data-Link Based on Hollow Plastic Cable and CMOS Transceiver [J].
Kim, Yanghyo ;
Nan, Lan ;
Cong, Jason ;
Chang, Mau-Chung Frank .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2013, 23 (12) :674-676
[4]  
Van Thienen N, 2016, PROC EUR SOLID-STATE, P483, DOI 10.1109/ESSCIRC.2016.7598346
[5]  
Voineau F, 2018, IEEE RADIO WIRELESS, P250, DOI 10.1109/RWS.2018.8305001