Online Junction-Temperature Extraction Method for SiC MOSFETs Utilizing Turn-on Delay

被引:4
作者
Kalker, Sven [1 ]
van der Broeck, Christoph H. [1 ]
De Doncker, Rik W. [1 ]
机构
[1] Rhein Westfal TH Aachen, Inst Power Elect & Elect Drives ISEA, Jaegerstr 17-19, D-52066 Aachen, Germany
来源
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA) | 2021年
关键词
Temperature sensitive electrical-parameter (TSEP); temperature sensing; thermal monitoring; SiC MOSFET; sensing circuit; SENSITIVE ELECTRICAL PARAMETERS;
D O I
10.1109/WiPDA49284.2021.9645104
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a method that extracts junction temperature of SiC MOSFETs by measuring a unique turn-on delay. In preceding work, the turn-on delay was identified as a particularly promising temperature-sensitive electrical parameter for SiC MOSFETs. The reasons for this are its simple calibration, its insensitivity to the device current, its linear temperature dependency as well as the particular behavior of the charge carrier mobility of SiC. However, state-of-the-art extraction circuits for turn-on delay only work with a limited time resolution. Thus, they can only be applied to slowly switched SiC MOSFETs. This work proposes a circuit for turn-on delay extraction with a time-to-digital converter that allows the time resolution to be significantly increased. Thereby, the circuitry allows utilizing turn-on delay as an effective temperature-sensitive electrical parameter for junction temperature extraction of SiC MOSFET operated with fast switching transients. The feasibility of the approach is experimentally validated in this work with a developed extraction circuit using a SiC MOSFET power module as a device under test.
引用
收藏
页码:378 / 383
页数:6
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