Dynamic optimization of multi-retrofit building envelope for enhanced energy performance with a case study in hot Indian climate

被引:36
作者
Saikia, Pranaynil [1 ]
Pancholi, Marmik [2 ]
Sood, Divyanshu [3 ]
Rakshit, Dibakar [1 ,4 ]
机构
[1] Indian Inst Technol Delhi, Ctr Energy Studies, New Delhi 110016, India
[2] Ahmedabad Univ, Sch Engn & Appl Sci, Ahmadabad 380009, Gujrat, India
[3] TERI Sch Adv Studies, Dept Energy & Environm, New Delhi 110070, India
[4] Curtin Univ, Sch Civil & Mech Engn, Bentley Campus, Bentley, WA, Australia
关键词
Building envelope; Heat gain; Phase change material; Insulator; Genetic algorithm; PHASE-CHANGE MATERIAL; OPTIMUM INSULATION THICKNESS; CHANGE MATERIAL WALLBOARD; CHANGE MATERIAL PCM; THERMAL PERFORMANCE; MELTING TEMPERATURE; EXTERNAL WALLS; LAYER; ROOF; LOCATION;
D O I
10.1016/j.energy.2020.117263
中图分类号
O414.1 [热力学];
学科分类号
摘要
When multiple thermal retrofits are to be installed in a building envelope for improving its energy performance, several questions arise such as "what should be the thickness of retrofits and where they should be placed within the wall/roof", "which retrofit should be installed towards the exterior and which one should be installed towards the interior of the envelope". Such judgements are made in contemporary studies by comparing limited predefined configurations where either the thickness or the location of retrofit assumes only a few discrete values within the envelope. The novel approach proposed in this study utilizes spatial discretization of structural layers in a composite envelope for two fold benefit. A new version of Genetic Algorithm (GA) is developed for this purpose by modifying its key operational stages. The GA is implemented in a practical scenario to optimally configure a multi-retrofit envelope (carrying phase change material and thermal insulator) of a common residential building in hot climate of India. Analysis of a single housing unit demonstrates that up to 33.5% of heat gain reduction and 9.2 kWh/day of electricity saving are achievable with improved envelope design. (C) 2020 Elsevier Ltd. All rights reserved.
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页数:18
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