Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints

被引：13

作者：

Lee, JG ^{[1
]}

Subramanian, KN ^{[1
]}

机构：

[1] Michigan State Univ, Dept Chem Engn & Mat Sci, E Lansing, MI 48824 USA

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2005年 / 17卷 / 01期

关键词：

solder; alloys; joining processes; fatigue;

D O I：

10.1108/09540910510579221

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Purpose - To determine the role of microstructure in the creep and thermomechanical fatigue (TMF) properties of solder joints made with eutectic Sn-Ag solder, and Sn-Ag solder with Cu and/or Ni additions. Design/methodology/approach - Quaternary alloys containing small amounts of Cu and Ni exhibit better high temperature creep resistance and also better resistance to damage under TMF cycles with a longer dwell time at the high temperature extreme, than eutectic Sn-Ag, and Sn-Ag-Cu ternary alloy solder joints. Microstructural evaluation was conducted to investigate the effects of Ni additions to Sn-Ag-based solder joints. Findings - Microstructural studies of the quaternary solder alloys revealed the presence of small ternary Cu-Ni-Sn intermetallic compound particles at Sn-Sn grain boundaries. These precipitates can retard the grain boundary sliding that will occur during TMF with longer dwell times at the high temperature extreme, and during high temperature creep. Originality/value - The findings of this paper will help to provide an understanding of the effects of alloying elements on Sn-Ag based solder joints.

引用

页码：33 / 39

页数：7

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