INFLUENCES OF SELECTED PARAMETERS OF TECHNOLOGICAL PROCESS ON PROPERTIES AND BEHAVIOUR OF SYSTEMS THIN FILM - SUBSTRATE

被引：0

作者：

Stepanek, Ivo ^{[1
]}

Fait, Josef ^{[2
]}

Cip, Jaroslav ^{[3
]}

机构：

[1] Zapdoceska Univ Plzni, Univ 22, Plzen 30614, Czech Republic

[2] PILSEN TOOLS, Plzen 31600, Czech Republic

[3] CzechCoating, Dolni Becva 75655, Czech Republic

来源：

METAL 2011: 20TH ANNIVERSARY INTERNATIONAL CONFERENCE ON METALLURGY AND MATERIALS | 2011年

关键词：

thin films; thin film systems; bias-voltage;

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The paper is devoted by evaluation of influence of selected parameters of technology process of deposition thin films on final properties and behaviour of systems thin film - substrate. The main attention is on evaluation of possibility to find very small differences of properties and behaviour of thin film systems by indentation tests with different value of normal force and different kind of loading of thin films of material systems. In some case differences are very good analysed, in other cases differences are given after more detail complex analyses of results. There are analysed thin film systems with thin films created by low voltage reactive arc evaporation in vacuum. There are analysed influences of kind of thin films, bias voltage, interlayers and preparing before deposition process.

引用

页码：820 / 827

页数：8