Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

被引：9

作者：

Tan, CM ^{[1
]}

Gan, ZGB ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore

来源：

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2003年 / 3卷 / 02期

关键词：

bondpad peeling; confocal microscope; failure mechanism; finite element analysis; skidding; thermosonic bonding;

D O I：

10.1109/TDMR.2003.814408

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause :of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated.

引用

页码：44 / 50

页数：7

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