Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu

被引:9
作者
Niu, Xiaoyan [1 ]
Dong, Guoqiang [1 ]
Li, Xiaomeng [1 ]
Geng, Xuchen [1 ]
Zhou, Jiang [2 ]
机构
[1] Hebei Univ, Coll Civil Engn & Architecture, Baoding 071002, Peoples R China
[2] Lamar Univ, Dept Mech Engn, Beaumont, TX 77706 USA
关键词
Lead-free solder SAC0307; Nanoindentation test; Mechanical properties; Indentation size effect; Creep strain rate; LEAD-FREE SOLDERS; SN-AG; INTERMETALLIC COMPOUNDS; CREEP-BEHAVIOR; TEMPERATURE CREEP; SIZE; DEFORMATION; EVOLUTION; SILVER; RELIABILITY;
D O I
10.1016/j.microrel.2021.114429
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, nanoindentation tests with continuous stiffness measurement (CSM) technique were conducted on Sn0.3Ag0.7Cu (SAC0307) at room temperature. The mechanical properties and creep behavior of SAC0307 under different indentation depths and strain rate were studied. Results show that SAC0307 alloy has good plastic deformation ability and the contact stiffness increases linearly with the depth of the indentation. Under different indentation depths and strain rates, the hardness of the material will be affected by the indentation size effect (ISE). Moreover, the hardness shows a certain strain rate sensitivity under the action of different strain rates. The elastic modulus of the material is almost constant with the increase of the indentation depth during the indentation process. But at lower indentation depth (hmax = 500 nm), the elastic modulus-displacement curve fluctuates greatly due to ISE affect. Based on the Nix-Gao model, the hardness (H0) of SAC0307 is 0.2GPa, and the micro characteristic length h* is 867 nm. For the same holding time, creep deformation is more evident under high strain rate and indentation depths. The creep strain rate decrease with the increase of holding time and tends to a constant value.
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页数:7
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