Modeling of crack repair using piezoelectric material: XFEM approach

被引:9
作者
Kumar, Ritesh [1 ]
Pathak, Himanshu [2 ]
Singh, Akhilendra [1 ]
Tiwari, Mayank [1 ]
机构
[1] Indian Inst Technol, Dept Mech Engn, Patna, Bihar, India
[2] Indian Inst Technol, Sch Engn, Mandi, Himachal Prades, India
关键词
Piezoelectric; Stress intensity factor; J-integral; Thermo-mechanical loading; XFEM; STRESS INTENSITY FACTORS; ACTIVE REPAIR; ORTHOTROPIC COMPOSITE; FRACTURE-ANALYSIS; SIMULATION; BRITTLE; PATCHES; FRONTS; LOAD;
D O I
10.1108/EC-01-2020-0001
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
Purpose The purpose of this paper is to analyze the repair of a straight and angular crack in the structure using a piezoelectric material under thermo-mechanical loading by the extended finite element method (XFEM) approach. This provides a general and simple solution for the modeling of crack in the structure to analyze the repair. Design/methodology/approach The extended finite element method is used to model crack geometry. The crack surface is modeled by Heaviside enrichment function while the crack front is modeled by branch enrichment functions. Findings The effectiveness of the repair is measured in terms of stress intensity factor and J-integral. The critical voltage at which patch repair is most effective is evaluated and presented. Optimal patch shape, location of patch, adhesive thickness and adhesive modulus are obtained for effective repair under thermo-mechanical loading environment. Originality/value The presented numerical modeling and simulation by the XFEM approach are of great benefit to analyze crack repair in two-dimensional and three-dimensional structures using piezoelectric patch material under thermo-mechanical loading.
引用
收藏
页码:586 / 617
页数:32
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